US Patent Issued to QUALCOMM on July 21 for "Techniques for initial sidelink beam forming" (New Jersey, Pennsylvania Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,427, issued on July 21, was assigned to QUALCOMM Inc. (San Diego).

"Techniques for initial sidelink beam forming" was invented by Qing Li (Princeton Junction, N.J.), Junyi Li (Fairless Hills, Pa.) and Hong Cheng (Basking Ridge, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Certain aspects of the present disclosure provide techniques for wireless communication. An example method includes receiving configuration information indicating one or more configurations for an initial sidelink beamforming procedure involving one or more transmit beams, each associated with a respective antenna panel of a first UE, and performing the initial sidelink beam...