US Patent Issued to QUALCOMM on July 14 for "Techniques for sidelink relay handover procedure" (American, Chinese, Indian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,437, issued on July 14, was assigned to QUALCOMM Inc. (San Diego).

"Techniques for sidelink relay handover procedure" was invented by Peng Cheng (Beijing), Karthika Paladugu (Hyderabad, India), Hong Cheng (Basking Ridge, N.J.) and Gavin Bernard Horn (La Jolla, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wireless communications are described. A first user equipment (UE) may relay wireless communications between a first base station and a second UE via at least a sidelink communication link with the second UE. The first UE may transmit, to the first base station, a measurement report for one or more candidat...