US Patent Issued to QUALCOMM on July 14 for "Self-aligned backside contact module for 3DIC application" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,120, issued on July 14, was assigned to QUALCOMM Inc. (San Diego).

"Self-aligned backside contact module for 3DIC application" was invented by Qingqing Liang (San Diego), Periannan Chidambaram (San Diego), George Pete Imthurn (San Diego) and Stanley Seungchul Song (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are integrated circuit structures with through-substrate vias (TSVs) processed through self-aligned contact modules. As a result, much smaller and/or denser TSVs are formed with low mechanical stress. The denser TSVs allow for more flexible wiring options."

The patent was filed on Sept. 19, 2022, under Application No. 17/...