US Patent Issued to QUALCOMM on July 14 for "Package comprising a chiplet located between an integrated device and a metallization portion" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,219, issued on July 14, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising a chiplet located between an integrated device and a metallization portion" was invented by Yanmei Song (San Diego), William Stone (San Diego), Jianwen Xu (San Diego), Senthil Sivaswamy (San Diego), John Holmes (Escondido, Calif.) and Ryan Lane (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a first metallization portion, a first integrated device coupled to the first metallization portion through a first plurality of pillar interconnects, and a first chiplet located between the first integrated device and the first metallization por...