US Patent Issued to QUALCOMM on July 14 for "Optimized subframe blanking for dual sim dual active" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,555, issued on July 14, was assigned to QUALCOMM Inc. (San Diego).

"Optimized subframe blanking for dual sim dual active" was invented by Ravinder Kumar (San Diego), Abbas Termos (San Diego), Pak Yin Tam (San Jose, Calif.) and Qiang Shen (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "The apparatus in some aspects may be a wireless device configured to operate a first transceiver in a first connected mode with a first radio access network (RAN) and a second transceiver in a second connected mode with a second RAN. The apparatus may further be configured to transmit a first communication via the first transceiver and obtain, based on a seco...