US Patent Issued to QUALCOMM on July 14 for "Logic circuits including circuits of different heights and related method of fabrication" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,874, issued on July 14, was assigned to QUALCOMM Inc. (San Diego).

"Logic circuits including circuits of different heights and related method of fabrication" was invented by Haining Yang (San Diego), Hyunwoo Park (San Diego), Ming-Huei Lin (New Taipei City, Taiwan) and Junjing Bao (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A logic circuit includes a first circuit having a first diffusion region and a second diffusion region and a second circuit having a third diffusion region, and a fourth diffusion region. First devices in the first circuit each include a portion of the first diffusion region and a portion of the second diffusion reg...