US Patent Issued to QUALCOMM on Aug. 25 for "Device having an in-substrate inductor and method for making the inductor" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,774, issued on Aug. 25, was assigned to QUALCOMM Inc. (San Diego).

"Device having an in-substrate inductor and method for making the inductor" was invented by Kai Liu (Phoenix), Jui-Yi Chiu (Taichung City, Taiwan) and Jonghae Kim (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a device including an inductor that includes a substrate; a plurality of vias disposed through the substrate and filled with a conductive metal; a via structure disposed through the substrate and extending between the plurality of vias, wherein the via structure is filled with a magnetic material to form a magnetic core of the inductor; and one or more p...