US Patent Issued to QUALCOMM on Aug. 11 for "Package comprising sidewall interconnects configured for power routing" (California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,057, issued on Aug. 11, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising sidewall interconnects configured for power routing" was invented by Xia Li (San Diego), Xuefeng Zhang (San Diego) and Aniket Patil (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device comprising a package. The package comprises a package substrate; a first integrated device coupled to the package substrate through a first plurality of bump interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a plurality of post interconnects located in the encapsulation layer; a metallization portion coupled to the plur...