US Patent Issued to QUALCOMM on April 14 for "Network slice feasibility assessment for a latency-based service level agreement (SLA)" (Israeli, Romanian, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,821, issued on April 14, was assigned to QUALCOMM Inc. (San Diego).

"Network slice feasibility assessment for a latency-based service level agreement (SLA)" was invented by Gal Izhaki (Haifa, Israel), Andrei Vadeanu (Bucharest, Romania), Daniel Yellin (Raanana, Israel) and Atanu Basudeb Halder (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure provides systems, methods, devices, and apparatuses, including computer programs encoded on computer storage media, for network slice feasibility assessment for a latency-based service level agreement (SLA). Some aspects relate to providing on-demand approval or rejection of a network s...