US Patent Issued to Qorvo US on Oct. 6 for "Wafer-level hybrid bonded RF switch with redistribution layer" (North Carolina Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,792, issued on Oct. 6, was assigned to Qorvo US Inc. (Greensboro, N.C.).

"Wafer-level hybrid bonded RF switch with redistribution layer" was invented by Michael Carroll (Jamestown, N.C.), Eric K. Bolton (Kernersville, N.C.), Ma Shirley Asoy (High Point, N.C.), Xi Luo (High Point, N.C.), Daniel Charles Kerr (Oak Ridge, N.C.) and Chi-Hsien Chiu (High Point, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of an IC device are disclosed. In some embodiments, an integrated circuit (IC) device, includes: an first active semiconductor layer that includes first active semiconductor device regions; a second active semiconductor layer that inclu...