ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,794, issued on Nov. 3, was assigned to Qorvo US Inc. (Greensboro, N.C.).

"Front-end module with vertically stacked die and circulator" was invented by Julio C. Costa (Oak Ridge, N.C.), George Maxim (San Jose, Calif.), Dirk Robert Walter Leipold (San Jose, Calif.) and Baker Scott (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a front-end module (FEM) and a process for making the same. In the disclosed FEM, a thinned flip-chip die, which includes a device region with a metal layer, resides over a module carrier. A mold compound resides over the module carrier, surrounds the thinned flip-chip die, and e...