US Patent Issued to Qorvo US on June 23 for "Stacked die package and methods of forming the same" (North Carolina Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,009, issued on June 23, was assigned to Qorvo US Inc. (Greensboro, N.C.).

"Stacked die package and methods of forming the same" was invented by Julio C. Costa (Oak Ridge, N.C.) and Robert L. Sowell III (Greensboro, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a process for making a three-dimensional (3D) package, which starts with providing a mold precursor module that includes a first device die and a floor connectivity die (FCD) encapsulated by a mold compound. The FCD includes a sacrificial die body and multiple floor interconnections underneath the sacrificial die body. Next, the mold compound is thinned d...