US Patent Issued to Qorvo US on July 14 for "Delamination/cracking improvement at solder joints in microelectronics package" (Texas, Florida Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,205, issued on July 14, was assigned to Qorvo US Inc. (Greensboro, N.C.).

"Delamination/cracking improvement at solder joints in microelectronics package" was invented by Yinbao Yang (Allen, Texas), Xiaokang Huang (Plano, Texas) and Kenneth Frazee (Orlando, Fla.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a microelectronics package with significantly reduced delamination/cracking at solder joints, and a process for making the same. The disclosed microelectronics package includes a carrier, a solder joint region over the carrier, a top intermetallic (IMC) layer over the solder joint region, and a device die over t...