US Patent Issued to QING DING PRECISION ELECTRONICS (HUAIAN), Avary Holding (Shenzhen) Co. Ltd. on July 28 for "System-in-package module and method for manufacturing the same" (Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,766, issued on July 28, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China) and Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China).

"System-in-package module and method for manufacturing the same" was invented by Man-Zhi Peng (Huaian, China), Ming-Jaan Ho (New Taipei, Taiwan) and Xian-Min Du (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a system-in-package module includes providing a carrier plate; mounting a plurality of electronic components on the carrier plate, wherein the plurality of electronic components are electrically connected to the carrier plate; providing a pla...