US Patent Issued to QING DING PRECISION ELECTRONICS (HUAIAN), Avary Holding (Shenzhen) Co. Ltd. on July 14 for "Method for manufacturing a multilayer circuit board" (Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,698, issued on July 14, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China) and Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China).

"Method for manufacturing a multilayer circuit board" was invented by Lan-Ting Chao (Shenzhen, China), Yin-Ju Chen (New Taipei, Taiwan) and Zheng-Ting Jiao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a multilayer circuit board includes providing an inner circuit substrate defining a through hole, attaching a support plate to the inner circuit substrate to seal an opening of the through hole; placing an electronic module in the through hole; pr...