US Patent Issued to pSemi on Feb. 24 for "Wafer fabrication process and devices with extended peripheral die area" (California Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,019, issued on Feb. 24, was assigned to pSemi Corp. (San Diego).

"Wafer fabrication process and devices with extended peripheral die area" was invented by Thomas Nguyenphuoc (Anaheim Hills, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor (SC) chip devices and associated methods of making are presented. The SC chips are designed to include enlarged extension semiconductor areas next to functional integrated circuit (IC) dies on these SC chips. Some variations include designing semiconductor wafers prior to fabrication so that the resultant IC dies are surrounded by the extension semiconductor areas. Other variations include proces...