US Patent Issued to PROLOGIUM TECHNOLOGY on July 14 for "System for bonding films and method for preparing composite film using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,045, issued on July 14, was assigned to PROLOGIUM TECHNOLOGY Co. LTD. (Taoyuan City, Taiwan).

"System for bonding films and method for preparing composite film using the same" was invented by Jhi-Jhong Lin (Taoyuan City, Taiwan), Chia-Ming Lin (Taoyuan City, Taiwan) and Che-Ming Kuo (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for bonding films includes a first film, a second film having a plurality of elements, a bonding roller, and a deformable roller having a deformable outer layer. The stiffness of the second film is less than that of the first film. By using the system, the deformable outer layer of the deformab...