US Patent Issued to PRINICS on Sept. 1 for "Thermal print head with COF structure" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,722,401, issued on Sept. 1, was assigned to PRINICS Co. LTD. (Suwon-si, South Korea).

"Thermal print head with COF structure" was invented by Kwang-Ho Noh (Suwon-Si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The thermal print head having COF structure is disclosed. According to the present invention, productivity can be improved with a low step of a protective resin by using a COF method, the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate by electrically connecting the ceramic substrate and the COF through thermal compression using ACF, and the height of the thermally comp...