US Patent Issued to Powertech Technology on Feb. 17 for "Semiconductor packaging assembly and semiconductor packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,692, issued on Feb. 17, was assigned to Powertech Technology Inc. (Hsinchu, Taiwan).

"Semiconductor packaging assembly and semiconductor packaging structure" was invented by Kun-Yung Huang (Hukou, Taiwan) and Jen-I Huang (Hukou, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor packaging assembly includes a redistribution layered structure having a plurality of device regions and a plurality of cutting regions separating the device regions, a plurality of recess structures respectively formed in the cutting regions, a plurality of chips respectively disposed in the device regions, and an encapsulating layer formed on the redistri...