ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,014, issued on April 7, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan).
"Package device and manufacturing method thereof" was invented by Shang-Yu Chang Chien (Hsinchu County, Taiwan), Nan-Chun Lin (Hsinchu County, Taiwan) and Hung-Hsin Hsu (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package device and a manufacturing method thereof are provided. The package device includes a substrate, a plurality of conductive pillars, a redistribution layer, at least one bridge chip, at least two active chips, an encapsulant, and an underfill layer. The conductive pillars are disposed on the substrate side by side,...