US Patent Issued to Powerchip Semiconductor Manufacturing on March 31 for "Backside illuminated image sensor structure including light pipe structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,519, issued on March 31, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Backside illuminated image sensor structure including light pipe structure and manufacturing method thereof" was invented by Yu Ling Huang (Hsinchu City, Taiwan) and Yu-Yuan Lai (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A backside illuminated image sensor structure including a pixel structure is provided. The pixel structure includes a substrate, a light sensing device, and at least one light pipe structure. The substrate includes a first surface and a second surface opposite to each other. The second surface has at le...