US Patent Issued to PIERBURG on Oct. 6 for "Power semiconductor package" (German, American Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,757, issued on Oct. 6, was assigned to PIERBURG GMBH (Neuss, Germany).

"Power semiconductor package" was invented by Mika Nuotio (San Jose, Calif.), Dieter Jelinek (Kaarst, Germany), Oguz Demir (Heilbronn, Germany) and Patrick Bauer (Hassmersheim, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor package includes a first substrate assembly with power semiconductor dies, a second substrate assembly arranged parallel to the first substrate assembly, and source contacts. The second substrate assembly has a copper cladding layer which defines a source copper cladding layer circuit having a bonding area which, when mechanically ...