US Patent Issued to PIERBURG on April 21 for "Power semiconductor package" (German, American Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,833, issued on April 21, was assigned to PIERBURG GMBH (Neuss, Germany).

"Power semiconductor package" was invented by Mika Nuotio (San Jose, Calif.), Oguz Demir (Heilbronn, Germany) and Patrick Bauer (Hassmersheim, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor package includes a first substrate assembly with a power semiconductor die defining a high-side power switch, a second substrate assembly arranged parallel to the first substrate assembly which has a power semiconductor die defining a low-side power switch, and a power terminal assembly. The power terminal assembly includes a power terminal substrate arranged b...