US Patent Issued to PI Advanced Materials on March 24 for "Polyimide film having high dimensional stability, and method for manufacturing same" (South Korean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,983, issued on March 24, was assigned to PI Advanced Materials Co. Ltd. (Chungcheongbuk-do, South Korea).

"Polyimide film having high dimensional stability, and method for manufacturing same" was invented by Dong-Young Kim (Chungcheongbuk-do, South Korea), Dae-Geon Yoo (Chungcheongbuk-do, South Korea) and Dong-Young Won (Chungcheongbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides: a polyimide film having excellent dimensional stability; and a method for manufacturing same, wherein the polyimide film has a coefficient of thermal expansion of 1 ppm/deg C. to 5 ppm/deg C., an elastic modulus of 9 GPa to...