US Patent Issued to PHOENIX PIONEER TECHNOLOGY on Sept. 22 for "Semiconductor package carrier board structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,651, issued on Sept. 22, was assigned to PHOENIX PIONEER TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan).

"Semiconductor package carrier board structure and manufacturing method thereof" was invented by Pao-Hung Chou (Hsinchu County, Taiwan) and Ming-Yeh Chang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package carrier board structure includes a plurality of carrier board bodies and a plurality of supporting bumps. The carrier board body includes a build-up circuit structure and a plurality of conductive blocks bonded to the build-up circuit structure. Adjacent ones of the carrier board bodies are connected t...