ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,838, issued on April 21, was assigned to PHOENIX PIONEER TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan).
"Component-embedded packaging structure" was invented by Chu-Chin Hu (Hsinchu County, Taiwan), Shih-Ping Hsu (Hsinchu County, Taiwan) and Chih-Kuai Yang (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A component-embedded packaging structure is provided, in which a plurality of metal layers are formed on an inactive surface of a semiconductor chip so as to serve as a buffer portion, and the semiconductor chip is disposed on a carrying portion with the buffer portion via an adhesive. Then, the semiconductor chip is encapsulat...