US Patent Issued to PERIDOT PRINT on Sept. 8 for "3D structures to encapsulate build material" (American, Chinese, Mexican Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,600, issued on Sept. 8, was assigned to PERIDOT PRINT LLC (Palo Alto, Calif.).

"3D structures to encapsulate build material" was invented by Jacob Wright (San Diego), Maria Fabiola Leyva Mendivil (Guadalajara, Mexico), Sunil Kothari (Palo Alto, Calif.), Lei Chen (Shanghai), Kyle Wycoff (Palo Alto, Calif.) and Jun Zeng (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A computing device comprising a controller is disclosed herein. The controller is to access print data of a virtual build volume including a 3D object to be generated by a 3D printer; modify the print data to include a 3D structure at a location within the build volume t...