US Patent Issued to Parallel Wireless on May 19 for "Diameter multifold message" (Indian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,634,686, issued on May 19, was assigned to Parallel Wireless Inc. (Nashua, N.H.).

"Diameter multifold message" was invented by Manisha Sameer Gambhir Parekh (Pune, India) and Shivani Mehrotra (Pune, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, methods and computer software are disclosed for providing a Diameter multifold message. In one embodiment a method is disclosed, comprising: providing a multifold-command Attribute Value Pair (AVP), the multifold-command AVP including an AVP code, a set of VMP flags, an AVP length and a vendor ID; including the AVP in a Capabilities Exchange Request (CER) command for a Diameter stack supporting mul...