US Patent Issued to PANJIT INTERNATIONAL on March 3 for "Wafer-level-package device with peripheral side wall protection" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,844, issued on March 3, was assigned to PANJIT INTERNATIONAL INC. (Kaohsiung City, Taiwan).

"Wafer-level-package device with peripheral side wall protection" was invented by Chung-Hsiung Ho (Kaohsiung City, Taiwan), Wen-Liang Huang (Kaohsiung City, Taiwan) and Jeng-Sian Wu (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer-level-package device with peripheral side wall protection has a die, multiple conductive bumps, and a protection layer. The die has a top surface, a bottom surface, and a peripheral side wall. A cavity is formed on the peripheral side wall of the die and around the die. The multiple conductive bumps are m...