ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,849, issued on April 21, was assigned to PANJIT INTERNATIONAL INC. (Kaohsiung City, Taiwan).
"Semiconductor packaging structure" was invented by Chung Hsiung Ho (Kaohsiung City, Taiwan), Hung Min Liu (Kaohsiung City, Taiwan), Wen Liang Huang (Kaohsiung City, Taiwan) and Jeng Sian Wu (Kaohsiung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor packaging structure includes an encapsulation layer, a die, a first metal layer, a second metal layer and an electrical connection component. The die is disposed in the encapsulation layer. The first metal layer and the second metal layer are disposed in the encapsulation layer. The f...