US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Sept. 1 for "Substrate-bound adherend" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,724,517, issued on Sept. 1, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Substrate-bound adherend" was invented by Takuto Abe (Osaka, Japan), Keishu Muraoka (Osaka, Japan), Kota Araki (Osaka, Japan) and Takeshi Haritani (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adherend-equipped substrate includes a substrate and an adherend. The adherend is bonded to a front face of the substrate with the adhesive. The substrate includes a substrate body and a protective layer. The protective layer having a front face is disposed at a side of a front face of the substrate body. The front face of the protecti...