US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on May 12 for "Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,176, issued on May 12, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board" was invented by Hirosuke Saito (Osaka, Japan), Yiqun Wang (Osaka, Japan) and Hiroharu Inoue (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An aspect of the present invention is a resin composition containing a first styrene-based block copolymer having a hardness of 20 to 70, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula ...