US Patent Issued to Panasonic Intellectual Property Management on March 24 for "Cutting device and cutting method" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,144, issued on March 24, was assigned to Panasonic Intellectual Property Management Co. Ltd. (Osaka, Japan).

"Cutting device and cutting method" was invented by Ryuta Abe (Osaka, Japan), Tatsuya Masada (Hyogo, Japan) and Masahide Maruyama (Nara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cutting device for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate, a first active material layer, and a second active material layer, the cutting device including: a first process unit that causes a first cutting blade to form an incision in the first active material layer; and a second process u...