US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on March 17 for "Prepreg, and metal-clad laminated board and wiring substrate obtained using same" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,593, issued on March 17, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Prepreg, and metal-clad laminated board and wiring substrate obtained using same" was invented by Yasunori Hoshino (Osaka, Japan), Hiroaki Fujiwara (Nara, Japan), Yuki Kitai (Osaka, Japan), Takayoshi Ozeki (Osaka, Japan), Mikio Sato (Osaka, Japan) and Masashi Koda (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect of the present invention relates to a prepreg having a thermosetting resin composition or a semi-cured product of a thermosetting resin composition, and a fibrous base material, in which the thermosetting resi...