US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Feb. 17 for "Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,926, issued on Feb. 17, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board" was invented by Masafumi Honma (Fukushima, Japan), Ryuji Takahashi (Fukushima, Japan), Teppei Washio (Fukushima, Japan), Yuichi Ishikawa (Fukushima, Japan) and Hirofumi Midorikawa (Fukushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition contains: a curable resin (A); an acrylic-monomer copolymer (B) having a structure expressed by formulae (1) to (3) and having a weight average molecular weigh...