US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Aug. 4 for "Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,393, issued on Aug. 4, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board" was invented by Yasunori Hoshino (Hyogo, Japan), Yuki Kitai (Osaka, Japan) and Mikio Sato (Fukushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition includes: a polyphenylene ether compound having at least one of groups expressed by formulas (1) and (2), a curing agent reactable with the polyphenylene ether compound, a styrene-based polymer having structural units expressed by formulas (3) and (4...