US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on April 21 for "Method for manufacturing semiconductor device including forming opening in resist of the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,840, issued on April 21, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Method for manufacturing semiconductor device including forming opening in resist of the semiconductor device" was invented by Kiyokazu Itoi (Osaka, Japan), Keiko Ikuta (Osaka, Japan) and Daisuke Sakurai (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device includes providing a semiconductor element having electrode terminals; forming a resist on the semiconductor element, the resist having a first surface facing the electrode terminals and a second surface opposite to the first surfa...