ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,122, issued on Aug. 25, was assigned to Panasonic Housing Solutions Co. Ltd. (Osaka, Japan).
"Resin molded body" was invented by Tomokazu Kusunoki (Osaka, Japan), Kanji Sakuragi (Osaka, Japan), Shinji Fujimoto (Aichi, Japan) and Koichi Masukawa (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin molded body includes a resin structure, an intermediate layer including an inorganic filler and an organic resin binder and provided on a surface of at least a part of the resin structure, and a thermal sprayed ceramic coating provided on the intermediate layer. The inorganic filler is amorphous in shape and has a central particle diameter o...