US Patent Issued to PALDO on Sept. 15 for "Packaging for foodstuffs" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. D1,147,850, issued on Sept. 15, was assigned to PALDO Co. LTD. (Seoul, South Korea).

"Packaging for foodstuffs" was invented by Sung-Kyun Kwon (Seoul, South Korea).

The patent was filed on May 21, 2025, under Application No. D/004,753.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1147850&OS=D1147850&RS=D1147850

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