ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,380, issued on Oct. 6, was assigned to Pac Tech-Packaging Technologies Gmbh (Nauen, Germany).
"Bonding head and bonding apparatus" was invented by Matthias Fettke (Berlin), Andrej Kolbasow (Paulinenaue, Germany), Thorsten Krause (Hoppegarten, Germany) and Svetlana Milz (Berlin).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. Th...