US Patent Issued to OSRAM Opto Semiconductors on Sept. 8 for "Optoelectronic semiconductor element including a casing embedding a semiconductor chip and with crack nuclei located in the casing, and method for operating such an optoelectronic semiconductor element" (German, Dutch Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,314, issued on Sept. 8, was assigned to OSRAM Opto Semiconductors GmbH (Regensburg, Germany).

"Optoelectronic semiconductor element including a casing embedding a semiconductor chip and with crack nuclei located in the casing, and method for operating such an optoelectronic semiconductor element" was invented by Christian Betthausen (Lappersdorf, Germany), Olivier Leray (Regensburg, Germany), Muyuan Li (Regensburg, Germany), Benjamin Gruber (Regensburg, Germany), Michael Steyer (Neutraubling, Germany), Alexander Linkov (JL Waalre, Netherlands) and Stefan Handl (Zell, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment a method fo...