ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,702,999, issued on Aug. 11, was assigned to OSAKA UNIVERSITY (Osaka, Japan) and NTN Corp. (Osaka, Japan).
"Application apparatus and application method" was invented by Mitsuru Akashi (Suita, Japan), Takami Akagi (Suita, Japan), Atsushi Oda (Iwata, Japan), Shohei Chikae (Iwata, Japan) and Haruka Nakamura (Iwata, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An application apparatus includes: an application needle that applies, to a target, an application material having its viscosity changing under shear; a drive unit that moves the application needle up and down; and a controller that controls the drive unit to move the application needle such t...