US Patent Issued to OMNIVISION TECHNOLOGIES on Feb. 24 for "Interconnection clustering architecture in system-on-chip and method for facilitating data accessing and data transfer operations using the same" (Singaporean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,561,257, issued on Feb. 24, was assigned to OMNIVISION TECHNOLOGIES INC. (Santa Clara, Calif.).

"Interconnection clustering architecture in system-on-chip and method for facilitating data accessing and data transfer operations using the same" was invented by Wei Wang (Singapore), Chin Tong Thia (Singapore) and Yidan Chen (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A computing device is provided. The computing device includes a system-on-chip (SoC) device, and the SoC device includes a plurality of master devices and a stacked memory. The master devices are arranged on a die. The master devices are grouped in space into a plurality of logic...