US Patent Issued to OLYMPUS on March 24 for "Image pickup unit having resin in via holes for an endoscope" (Japanese Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,582,294, issued on March 24, was assigned to OLYMPUS Corp. (Tokyo).

"Image pickup unit having resin in via holes for an endoscope" was invented by Keiichi Kobayashi (Sagamihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An image pickup unit includes: an image pickup substrate including a first principal surface and a second principal surface, a light receiving circuit being formed on the first principal surface and a through wiring being placed on an inner surface of a via hole including an opening in the second principal surface; a solder resist film placed around the via hole on the second principal surface and in the via hole in a range f...