ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,225, issued on March 24, was assigned to OKUNO CHEMICAL INDUSTRIES Co. LTD. (Osaka, Japan).

"Resin material treatment method, and compositions for the same" was invented by Shingo Nagamine (Osaka, Japan) and Koji Kita (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that conta...