ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,438, issued on June 23, was assigned to okins electronics Co. Ltd (Uiwang-si, South Korea).
"Test socket and assembly device thereof" was invented by Jin Kook Jun (Gunpo-si, South Korea), Chan Ho Lee (Siheung-si, South Korea) and Seung Hyun Noh (Sacheon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A test socket for testing the electrical characteristics of a semiconductor device provides a test socket, including a housing in which a plurality of first through holes are formed; a cover in which a plurality of second through holes are formed; and a plurality of contact pins inserted into the plurality of first and second through hole...