US Patent Issued to OIP Technology on Feb. 17 for "Integrated photonics package and method of forming same" (Singaporean Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,079, issued on Feb. 17, was assigned to OIP Technology Pte Ltd. (Singapore).

"Integrated photonics package and method of forming same" was invented by How Yuan Hwang (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated photonics package and a method of forming it are disclosed. The integrated photonics package includes, encapsulated in a plastic encapsulation layer, an electrical signal module, a silicon photonics processing unit, a light-emitting unit, a heat sink structure and a micro-optical coupler. The electrical signal module is electrically connected and configured to both the silicon photonics processing unit and the light...