US Patent Issued to Ohio State Innovation Foundation on Sept. 15 for "Die assembly and methods for friction stir extrusion" (Ohio Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,571, issued on Sept. 15, was assigned to Ohio State Innovation Foundation (Columbus, Ohio).

"Die assembly and methods for friction stir extrusion" was invented by Rajiv Shivpuri (Columbus, Ohio).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are devices and methods related to friction stir extrusion. In particular, the present disclosure relates to die assemblies configured for use in a forward friction stir extrusion system and die assemblies configured for use in a backward friction stir extrusion system. The die assemblies in the forward and backward friction stir extrusion systems can include a die piece comprising a sloped surf...