US Patent Issued to Ohio State Innovation Foundation on Oct. 6 for "Systems and methods for joining and repair using ultrasonic additive manufacturing with a contoured sonotrode" (Ohio Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,366, issued on Oct. 6, was assigned to Ohio State Innovation Foundation (Columbus, Ohio).

"Systems and methods for joining and repair using ultrasonic additive manufacturing with a contoured sonotrode" was invented by Marcelo Dapino (Columbus, Ohio), Leon Headings (Columbus, Ohio) and Mark Gingerich (Columbus, Ohio).

According to the abstract* released by the U.S. Patent & Trademark Office: "An ultrasonic additive manufacturing system may include a base structure, a sonotrode configured to rotate about an axis of rotation, and one or more transducers configured to vibrate the sonotrode. The sonotrode may include a welding surface extending along a circumference of the sonotrode, a...