US Patent Issued to NXP USA on Sept. 8 for "Two-part molding of device packages with spacers" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,537, issued on Sept. 8, was assigned to NXP USA INC. (Austin, Texas).

"Two-part molding of device packages with spacers" was invented by Ankur Shah (Chandler, Ariz.) and Michael B. Vincent (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device package is formed form a volume of molding material that encapsulates a component. Edges of the component are protected by encapsulated areas formed above the edges by a filler material prior to molding the component. The molding material also encapsulates the filler material and positioning of the filler material defines a location and dimensions of an aperture in the molding material that e...